ANALOGY BETWEEN THE THERMAL CONDUCTIVITY AND ELECTRICAL CONDUCTIVITY FOR COMMON LIQUIDS
Vinay Atgur
Assistant Professor, Dept. of Mechanical Engineering, TKIET, Warananagar Maharashtra, India.
Suresh B
Assistant Professor, Dept. of Civil Engineering, BIET, Davangere, Karnataka, India
Manavendra G
Associate Professor, Dept. of Mechanical Engineering, BIET, Davangere, Karnataka, India.
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In the present scenario there is a huge demand for new advanced liquids with improved thermal properties like thermal conductivity for broad ranges of heat transfer applications. The present work describes the analogy of the liquids thermal conductivity and electrical conductivity data measured by using guarded hot plate method which is a steady state method and conductivity meter a transient method. Experiment is carried out for different low viscous samples like normal water, distilled water and it is observed that thermal conductivity increases as temperature increases same trend is observed for electrical conductivity also. An optimum value of 0.609 W/m°c and 22.24 μs /cm is observed for distilled water and for normal water value of 0.573 W /m°c and 1.035 μs /cm is recorded. For heavy viscous liquids it is observed that as temperature increases both thermal conductivity and electrical conductivity decreases. Value of 0.205 W/ m°c and 8.45 μs /cm is documented for ethanol. And for toluene value of 0.192 W/ m°c is and 2.15 μs/cm is recorded. Experiment is carried out at range of temperatures thermal conductivity is measured by both the methods recorded data is analyzed and discussed. Both thermal conductivity and electrical conductivity are undistinguishable.
Keywords: Thermal conductivity; Heat transfer; conductivity meter; guarded hot plate.
- L.T. Yeh, Review of heat transfer technologies in electronic equipment, Journal of Electronic Packaging 117 (1995) 333–339
- T.-E. Tsai, H.-H. Wu, C.-C. Chang, S.-L. Chen, Two-phase closed thermo syphonvapor-chamber system for electronic cooling, International Communications in Heat and Mass Transfer37 (2010) 484–489
- A. Bar-Cohen, A.D. Kraus, S.F. Davidson, Thermal frontiers in the design and packaging Of microelectronic equipment, 105 (6) (1983) 53–59.
- C.T. Nguyen, G. Roy, C. Mechanical Engineering Gauthier, N. Galanis, Heat transfer enhancement usingAl2O3 water Nano fluid for an electronic liquid cooling system, Applied Thermal Engineering 27 (2007) 1501–1506.
- S. Nukiyama, Y. Yoshizawa, Thermal conductivities of water, seawater, and some Water solutions, JSME 37 (1934) 1934.
- R. Tufeu, B. Neindraen, D. Johannin, Thermal conductivity of certain liquids, Comptes Rendus 262 (1966) 229–231.
- Hust, J. G., and Smith, D. R., “Round-robin Measurements of the Apparent Thermal Conductivity of Two Refractory Insulation Materials, Using High-Temperature Guarded-Hot-Plate Apparatus,” Report No. NBSIR 88-3087, National Bureau of Standards, Boulder, CO, April 1988, 27 pp.
- Design Concepts for a New Guarded Hot Plate Apparatusfor Use Over an Extended Temperature Range By Robert R. Zarr and William Healy Heat Transfer and Alternative Energy Systems Group NIST Publication.
- M.H. Sharqawy, J.H. Lienhard V, S.M. Zubair, Thermo physical properties of seawater: A review of existing correlations and data, Desalin. Water Treat. 16 (2010) 354–380
- Ramirez MLV, Nieto De Castro CA, Perkins RA, Nagasaka Y, Nagashima A, Assale MJ, WA. Reference data for the thermal conductivity of saturated liquid toluene over a wide range of temperatures, J Phys Chem Ref Data. 2000; 29:133-9.
- Theory and application of conductivity application data sheet by Emerson process management.